Silicone TIF200-02E Gpu Laptop Thermal Conductive Silicon Heating
Thermal Pad For Cpu For Heat Sink
Product descriptions
TlF200-02E series thermally conductive interface materials are
applied to fill the air gaps between the heating elements and the
heat dissipation fins or the metal base.Their flexibility and
elasticity make them suited to coat very uneven surfaces. Heat can
transmit to the metal housing or dissipation plate from the heating
elements or even the entire PCB, which effecitly enhances the
efficiency and life-time of the heat-generating electronic
components.
Features
> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress application
> Available in varies thickness
> Easy release construction
> Electrically isolating
> Moldability for complex parts
Application
> LED Ceilinglamp
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
| Typical Properties of TIF200-02E Series |
| Color | Gray / White | Visual |
| Construction Reinforcement Carrier | Ceramic filled silicone elastomer | ********** |
| Thermal Conductivity | 1.25 W/mK | ASTM D5470 |
| Hardness | 35 Shore 00 | ASTM 2240 |
| Specific Gravity | 2.2g/cc | ASTM D297 |
| Thickness range | 0.020"-0.200" (0.5mm-5.0mm) | ASTM D374 |
| Dielectric Breakdown Voltage (T= 1mm above) | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.0MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Continuous Use Temp | – 40 To 160 ℃ | ********** |
| Outgassing (TML) | 0.35% | ASTM E595 |
| Flame Rating | 94 V0 | UL E331100 |
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm),Individual die cut shapesand and custom
thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Vietnam Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
