TIF112-12-10S-K1 Factory Custom Size Termal Pad 1.2W Laptop Silicone Thermal Pad​

The TIF™112-12-10S-K1 Series thermally conductive interface materials are gapfillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture-,tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

Features:

> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized

Applications:

> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp

Typical Properties of TIF112-12-10S-K1 Series
Property	Value	Test method
Color	Gray/Light amber	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Density	2.2g/cm³	ASTM D297
Thickness range	0.020"(0.5mm)~0.200"(5.0mm)	******
Hardness	60 ±5 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 120℃	***
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	4.5 MHz	ASTM D150
Volume Resistivity(Ohm-cm)	1.0X1012	ASTM D257
Fire rating	94 V0	UL equivalent
Thermal conductivity	1.2W/m-K	ASTM D5470

Standard Thicknesses:
0.010" (0.25mm), 0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm),

0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm),

0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm),

0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm),

0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Công ty Công nghệ Ziitek Việt Nam is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.