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TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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    Buy cheap TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials from wholesalers
     
    Buy cheap TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials from wholesalers
    • Buy cheap TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials from wholesalers
    • Buy cheap TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials from wholesalers

    TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF100N-40-10F
    Certification : RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/day
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials

    TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials


    Product descriptions


    TlFTM100N-40-10F thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


    Features

    > Good thermal conductive 2.0W/mK
    > Moldability for complex parts
    > Soft and compressible for low stress applications
    > Outstanding thermal performance
    > Easy release construction
    > Electrically isolating
    > High durability


    Application

    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Heat pipe thermal solutions
    > Memory Modules
    > Mass storage devices

    Typical Properties of TIFTM100N-40-10F Series
    PropertyValueTest method
    ColorGray*****
    Construction &CompostionCeramic filled silicone elastomer*****
    Specific Gravity2.1g/ccASTM D297
    Thickness range0.020inch (0.5mmT)~0.200inch (5.0mm)ASTM D374
    Hardness55±5 Shore 00ASTM 2240
    Continuos Use Temp-40 to 160℃*****
    Dielectric Constant4.7 MHzASTM D150
    Volume Resistivity7.3X1013Ohm-meterASTM D257
    Flame rating94 V0UL E331100
    Thermal conductivity4.0W/m-KASTM D5470

    Standard Thicknesses

    0.020-inch to 0.200-inch (0.5mm to 5.0mm)


    Product Sizes:

    8" x 16"(203mm x406mm)

    Individual die cut shapesand and custom thickness can be supplied.

    Please contact us for confirming

    TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile


    With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    Independent R&D team


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    Quality TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials for sale
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