TIF100-UF High Quality Thickness 0.5mm To 5.0mm Insulated Thermal
Pad Computer Cooling Thermal Pad
Product descriptions
TlFTM100-10UF is recommended for applications that require a minimum
amount of pressure on components. The viscoelastic nature of the
material also gives excellent low-stress vibration dampening and
shock absorbing characteristics. Ziitek TIF100-10UF is an
electrically isolating material, which allows its use in
applications requiring isolation between heat sinks and
high-voltage, bare-leaded devices.
Features
> Good thermal conductive 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
Application
> Mainboard/mother board
> Notebook
> Power supply
> Micro heat pipe thermal solutions
> CPU
> Mass storage devices
> Automotive electronics
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
| Typical Properties of TIFTM100-10UF Series |
| Property | Value | Test method |
| Color | Gray | ***** |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 2.2g/cc | ASTM D297 |
| Thickness range | 1.5mm | ASTM D374 |
| Hardness | 75 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ***** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 3.9 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Outgassing(TML) | 0.35% | ASTM E595 |
| Thermal conductivity | 1.5W/m-K | ASTM D5470 |
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Vietnam Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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