TISTM680-15AB 1.5w/Mk Thermal Potting Compound Silicone Thermal
Conductive Resin Potting Compound AB Glue
TIS™680-15AB is a two-component, high thermal conductive, low temperature
cured, long pot life, fire resistant Silicaencapsulant glue. lt is
design for potting of capacitors and electrical devices.Their
flexibility and elasticity make themsuited to the coating of the
very uneven surfaces. Heat can transmit to the metal housing or
dissipation plate from theseparate elements or even the entire PCB,
which in effect enhances the efficiency and life-time of the
heat-generatingelectronic components.
Feature
>Good thermal conductive: 1.5W/mK
>Excellent insulation and smoothly sourface.
>Low shrinkage
>Low viscosity, expediting air releaseed.
>Excellent in solvents and water proof.
>Longer life time.
>Excellent thermal shock efficiecy andimpact resistance
Application
>To potting LED Lighting heat spreader andpower- driver.
>Ferrite cements; tip type LED; good cementation toaromatic
polyester
>Relay sealant; Good adhesion to rubber, ceramics,PCB and plastics
>Power transformers and coils; Potting capacitors;Potting of small
electrical devices
>Adhesion to metal glass and plastic;LCD & substrates adhesion;
Coating and sealant;Coil ; IGBTS; Transformer; Fire retardant
>Optical / medical component adhesive
| Typical Properties of TISTM 680-15AB Series |
| Material Properties(before Curing) |
| | TIS680-15A | TIS680-15B |
| Color | White | Gray |
| Viscosity @25℃(mPa.s) | 4000±1000 cPS | 4000±1000 cPS |
| Specific Gravity | 2.3g/cc |
| Shelf life | 6 months @25℃ in sealed container |
| |
| Mixing Ratio (By weight) | TISTM680-15A : TISTM680-15B = 100 :100 |
| Working pot life ( 250g @25℃) | 30 mins |
| Conditions for Complete Curing | @25℃ 3Hours |
| @70℃ 20min |
| Material Properties(After Curing) |
| Hardness @25℃ (Shore D) | 85 |
| Operating temperature (℃) | -40 ~160 |
| Glass transition temperature Tg | 92℃ |
| Elongation(%) | 4.5 |
| CLTE (1/℃) | 3.0x 10-5 |
| Fire resistance UL | 94 V-0 |
Moisture absorption % wt gain 24 hours
waterimmersion @25℃ | < 0.1 |
| Thermal Conductivity (W/mK) | 1.5 |
| Thermal Impedance @10psi (℃-in²/W) | 0.36 |
| Dielectric Constant@1MHz | 4.2 |
| Dissipation factor @1 MHz | 0.029 |
| volume resistivity, ohm-cm @ 25℃ | 3.0x 1013 |
Package:
300ml/Tube, 24PCS/Box
Company Profile
Vietnam Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
