TIS^™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,long working time and fire resistance.lt is especially suitable for capacitor, small electronic equipment sealing. Its flexible, elastic characteristics enable it to provide cushioning for the materials it is coated with. The lower viscosity aliows the thermal potting adhesive to cover the surface more fully,greatly increasing the efficiency of heat transfer from the heating device or the entire PCB to the metal case or diffusion plate,thus improving the efficiency and service life of the electronic.

> Good thermal conductivity: 1.2W/mK

> Good insulation performance

> Good elasticity
> Lower shrinkage
> Low viscosity, easy gas emissions
> Good solvent resistance and waterproof performance
> Longer working hours

> Excellent high and low temperature resistance
> No odor release during thecuring process

Application

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.