TIF®100 12055-62 Custom 12W/Mk Silicone Conductive Soft Gpu Cpu Termal
Pad
Product descriptions
TIF®12055-62 series of thermal interface materials is specifically designed to fill
air gaps between heat-generating components and heat sinks or metal
baseplates. It offers excellent compliance, alowing it to conform
fightly to heat sources with varying shapes and height dferences.
Even in confined or iregular spaces,it maintains stable thermal
conductivity, enabling efficient heat transfer from discrete
components or the entire PCB to the metal housing or heat sink.
This significantly improves the heat dissipation efficiency of
electronic components, thereby enhancing operational stability and
extending device lifespan.
Features:
> Excellent thermal conductivity 12W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure
> Available in different thickness options
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications:
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED drivers and lamps
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
| Typical Properties of TIF®100 12055-62 Series |
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 3.3g/cc | ASTM D792 |
| thickness | 0.020"(0.5mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 55 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5000 VAC | ASTM D149 |
| Dielectric Constant | 6.5 MHz | ASTM D150 |
| Volume Resistivity(Ohm-cm) | ≥1.0X1012 | ASTM D257 |
| Fire rating | 94 V0 | UL (E331100) |
| Thermal conductivity | 12.0 W/m-K | ASTM D5470 |
Product Specification
Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided
hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for
materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For
other thicknesses or more information, please contact us.
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
