TIF500-50-11U High-Temperature Resistant Flame-Retardant Insulation
5.0W/MK Silicone Thermal Pad
Product descriptions
TlF500-50-11U Series is recommended for applications that require a
minimum amount of pressure on components. The viscoelastic nature
of the material also gives excellent low-stress vibration dampening
and shock absorbing characteristics. Ziitek TIF500-50-11U is an electrically isolating material, which allows its use in
applications requiring isolation between heat sinks and
high-voltage, bare-leaded devices.
Features
> Good thermal conductive 5.0W/mK
> Moldability for complex parts
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
| Typical Properties of TIF500-50-11U Series |
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 3.15g/cc | ASTM D792 |
| Thickness range | 0.020"(0.50mm)~0.200"(5.0mm) | ASTM D374 |
| Hardness | 27 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ***** |
| Dielectric Breakdown Voltage | >4500 VAC | ASTM D149 |
| Dielectric Constant | 4.0 MHz | ASTM D150 |
| Volume Resistivity | 3.0X10¹² Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 5.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries
in English of course.
Standard Export Carton Or Marked With Customer's Information Or
Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if
you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory
solution.
