TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu
Cpu Thermal Pad
Product descriptions
TIF®700PUS Series thermally conductive interface materials are applied to
fill the air gaps between the heating elements and the heat
dissipation fins or the metal base.Their flexibility and elasticity
make them suited to coat very uneven surfaces.Heat can transmit to
the metal housing or dissipation plate from the heating elements or
even the entire PCB, which effecitly enhances the efficiency and
life-time of the heat-generating electronic components.
Features
> Good thermal conductive 7.5W/mK
> Outstanding thermal performance
> Naturally tacky needing no further adhesive coating
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
| Typical Properties of TIF®700PUS Series |
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.2g/cc | ASTM D297 |
| thickness | 0.030"(0.75mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＞0.75mm) | 20 (Shore 00) | ASTM 2240 |
| Hardness (thickness≤ 0.75mm) | 50 (Shore 00) | |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥6000 VAC | ASTM D149 |
| Dielectric Constant | 4.5MHz | ASTM D150 |
| Volume Resistivity | ≥3.5X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 7.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Product Specification
Product Thicknesses: 0.030"(0.75mm)-0.200"(5.00mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided
hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for
materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For
other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries
in English of course.
Standard Export Carton Or Marked With Customer's Information Or
Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if
you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory
solution.
