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TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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    Buy cheap TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling from wholesalers
     
    Buy cheap TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling from wholesalers
    • Buy cheap TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling from wholesalers
    • Buy cheap TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling from wholesalers

    TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF700NUS
    Certification : RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/day
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling

    TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling


    Product descriptions


    TIF®700NUS series of thermal interface materials is specficlly designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tighty to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling eficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency ofelectronic components, thereby enhancing operational stability and extending device lifespan.


    Features

    > Good thermal conductive 8.5W/mK
    > Outstanding thermal performance
    > Naturally tacky needing no further adhesive coating
    > Available in varies thicknesses
    > Broad range of hardnesses available
    > Moldability for complex parts


    Application

    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > CPU
    > Display card
    > Mainboard/mother board
    > Notebook
    > Power supply
    > Heat pipe thermal solutions
    > Memory Modules
    > Mass storage devices

    Typical Properties of TIF®700NUS Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.5g/ccASTM D297
    thickness0.020"(0.50mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)20 (Shore 00)ASTM 2240
    Continuos Use Temp-45 to 200℃******
    Dielectric Breakdown Voltage≥6000 VACASTM D149
    Dielectric Constant4.5MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity6.5W/m-KASTM D5470

    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Product Specification
    Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
    Product Sizes:16" x 16"(406mm x406mm)
    Component Codes:
    Reinforcement Fabric: FG (Fiberglass).
    Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
    Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
    Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
    The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.

    TIF700NUS Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile


    Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    Independent R&D team


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