TIF060-16 Purple Silicone Thermal Gel For CPU
TIF060-16 is a soft silicone putty thermal gap filler,which blend with
exclusive formula,that offer superior thermal performance, and
compressibility.
Due to TIF060-16 is made by high vicosity silicon oil ,that can prevent thermal
formula seprate from it. Besides ,compared with traditionally
thermal pad, it can control bonded shifiting issue much better.
TIF060-16 operation mold is simliar as grease ,such as silkprint and screen
print or automatic injected facility.
TIF060-16 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA
package,DSP chip,LED lighting and other high power electric
component.
Feature
> Thermal conductivity: 6.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Mass storage devices
> Automotive electronics
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
| TIFTM060-16 Typical Properties |
| Property | Value | Test method |
| Color | Violet | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Flow rate(g/min) | 85 | Ziitek Test Method |
| Density | 3.4g/cm³ | ASTM D297 |
| Thermal conductivity | 6.0W/mK | ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) | 0.06 | ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) | 0.05 | ASTM D5470 |
| Specific heat capacity | 0.74 (J/g℃) | ASTM E1269 |
| Dielectric breakdown strength(V/mm) | ≥4000 | ASTM D149 |
| Bond line Thickness | 0.2mm | ASTM D374 |
| Recommended Operating temp | -45 ~200°C | Ziitek Test Method |
| Shelf Life @25℃；Original Packing | 6 months | ****** |
| Flame Rating | V-0 | UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing
applications.
Please contact us for confirming.
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat
dissipation. Please tell us your detailed applications and the
power, so we can recommend most suitable thermal conductive
materials.
