TIF100C 8045-11 High-Performance 8.0W Thermal Gap Filler Pad For
Lndustrial Equipment
Product descriptions
TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the
gaps between heat-generating components and liquid cooling plates
or metal bases.lts flexibility and elasticity make it ideal for
covering highly uneven surfaces.With excellent thermal
conductivity, it efficiently transfers heat from heat-generating
elements or PCBs to liquid cooling plates or metal heat dissipation
structures, thereby improving the cooling efficiency of high-power
electronic components and extending the lifespan of the equipment.
Features:
>Excellent thermal conductivity 8.0W/mK
>Self-adhesive without the need for additional surface adhesive
>Highly compressible, soft, and elastic
>Available in various thicknesses
>Good chemical stability
Applications:
>CPU and GPU processors and other chipsets
>High-performance computing (HPC)
>Industrial equipment
>Network communication devices
>New energy vehicles
| Typical Properties of TS-TIF®100C 8045-11 Series |
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.4g/cc | ASTM D297 |
| thickness | 0.012"(0.30mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 45 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 7.2MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 8.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact
us for details.
Store in a cool, dry place, away from fire and sunlight.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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