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TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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    Buy cheap TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling from wholesalers
     
    Buy cheap TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling from wholesalers
    • Buy cheap TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling from wholesalers
    • Buy cheap TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling from wholesalers

    TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF045-01
    Certification : RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 tube/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling

    TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling


    TIF045-01 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility.

    Due to TIF045-01 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.


    TIF045-01 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility.

    TIF045-01 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.


    Feature
    > Thermal conductivity: 4.5W/mK

    > Soft, very low compression

    > Low thermal inpedance

    > Operate automaticly

    > Proven long-term reliability


    Application
    > Mass storage devices
    > Heat-sink & frame
    > LED backlight module,LED lighting
    > High speed hardware driver
    > Micro heat pipe
    > vihicel enginee controler

    > Telecom industry
    > Semiconductor automaticlaboratory equipment.

    TIFTM045-01 Typical Properties
    PropertyValueTest method
    ColorBlackVisual
    Construction & CompositionCeramic filled silicon material*****
    Viscosity4000K mPa.sGB/T 10247
    Density2.95g/cm³ASTM D297
    Thermal conductivity4.5W/mKASTM D5470
    Thermal diffusivity1.651 mm²/sISO 22007-2
    Specific heat capacity2.7MJ/m3KISO 22007-2
    Continuous Use Temperature-45 ~200°CZiitek Test Method
    Dielectric breakdown strength200 V/milASTM D149
    Flame Rating94V0UL E331100

    Packing details

    30 cc/pc, 98 pc/box;

    300 cc/pc , 6 pc/box

    We offer the custom packaged in syringes for automated despensing applications.

    Please contact us for confirming.

    TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling

    Company Profile


    Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer

    6.Quality assurance contract

    Quality TIF045-01 High Thermal 6.5W Silicone Thermal conductive Gel For Gap Filling for sale
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