TIF100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling
Materials GPU Desktop Notebook
Product descriptions
TlF100-05S series is a silicone based, thermally conductive gap
pad. Its unreinforced construction allows additional compliancy.
This product has low hardness is conformable and is electrically
isolating. The low modulus characteristic of the product offers
optimal thermal performance with the ease of handling.
Features
> Good thermal conductivity
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress application
> Available in varies thickness
> Easy release construction
> Electrically isolating
> Moldability for complex parts
Application
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
| Typical Properties of TIF100-05S Series |
| Property | Value | Test method |
| Color | Blue | ***** |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 2.3g/cc | ASTM D297 |
| Outgassing(TML) | 0.35% | ASTM C351 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ***** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 1.5W/m-K | ASTM D5470 |
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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