Blcak Paster TIS580-13 One Component Dealcoholized Room Temperature
Cured Thermally Conductive Silicone Glue
TIS™580-13 Series is dealcoholized, one component, room temperature cure thermally
conductive silicone adhesive. It possesses good heat conduction and
adhesion towards electronic components. It can be cured to a higher
hardness elastomer, leads to firmly attached to substrates
resulting lower down thermal impedance. Thus, heat transfer among
heat source, heat-sink, motherboard, metal casing will become
effective.
TIS™580-13 Series possesses high thermal conductivity, excellent electrical
insulation and is ready-to-use.
TIS™580-13 Series has excellent adhesion to copper, aluminium, stainless-steel, etc.
As this is a dealcoholized system, it will not corrode, especially,
metal surfaces.
Feature
> Good thermal conductivity: 1.3W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Application
lt is widely used to replace thermal conductive silicone grease
(paste) and thermal conductive rubber pad as LED aluminum base
plate and radiator, high power electrical module and radiator
filling adhesive connect and heat dissipation. With this glue can
be removed from the traditional connection with cards and screws,
the result is more reliable filling heat dissipation, simpler
process, more economical cost.
Such as: can be widely used in personal portable computer
integrated circuit, microprocessor, high power LED, memory module,
buffer memory, sealed integrated chip, DC/AC converter, IGBT and
other power modules, semiconductors, relays, whole Package for
converters, transformers,etc.
| Typical values of TISTM580-13 |
| Appearance | Black paste | Test Method |
| Density(g/cm3,25℃) | 1.4 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7days | ***** |
| Elongation(psi) | ≥150 | ASTM D412 |
| Hardness(Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength(N/mm) | ＞3.5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 10 | ASTM D149 |
| Dielectric Constant ( @ 1MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.3 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Package:
300ml/Tube, 24PCS/Box
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting
point thermal interface materials, thermal conductive insulators,
thermally conductive tapes, electrically & thermally conductive
Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
