One Componen TIS580-10 Dealcoholized Room Temperature Cured
Thermally Conductive Silicone Adhesive
TIS™580-10 Series is dealcoholized, one component, room temperature cure thermally
conductive silicone adhesive. It possesses good heat conduction and
adhesion towards electronic components. It can be cured to a higher
hardness elastomer, leads to firmly attached to substrates
resulting lower down thermal impedance. Thus, heat transfer among
heat source, heat-sink, motherboard, metal casing will become
effective.
TIS™580-10 Series possesses high thermal conductivity, excellent electrical
insulation and is ready-to-use.
TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel, etc.
As this is a dealcoholized system, it will not corrode, especially,
metal surfaces.
Feature
> Good thermal conductivity: 1.0W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Application
It mainly used in substituting thermally-conductive paste and pads,
which currently finds in gap-filling adhesives or heat conduction
between LED aluminium motherboard and heat sink, high power
electrical module and heat sink. Traditional methods such as fins
and screws fixing can be replaced by applying TIS580-10, resulting
a more reliable gap-filling thermal conduction, simplified handling
and more cost-effective. E.g. Massive application in integrated
circuits in portable computer, microprocessor, high power LED,
internal storage module, cache, integrated circuits, DC/AC
translator, IGBT and other power modules, encapsulation of
semi-conductors, relay switches, rectifiers and transfomers
| Typical values of TISTM580-10 |
| Appearance | White paste | Test Method |
| Density(g/cm3,25℃) | 1.3 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 30K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7 | ***** |
| Elongation(%) | ≥200 | ASTM D412 |
| Hardness(Shore A) | 45 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.5 | ASTM D1876 |
| Peel Strength(N/mm) | ＞5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.0 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Package:
300ml/Tube, 24PCS/Box
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the
R&D, manufacture and sales of the thermal interface materials
(TIMs). We have rich experiences in this field which can support
you the latest, most effective and one -step thermal management
solutions. We have many advanced production equipments,full test
equipments and fully automatic coating production lines which can
support the production for high performance thermal silicone pad,
thermal graphite sheet/ film, thermal double-sided tape, thermal
insulation pad, thermal ceramic pad, phase change material, thermal
grease etc. UL94 V-0, SGS and ROHS are compliant.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and
message to us.
This message should include any questions you might have about the
products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the
process and send your message to us
4. We will reply you as soon as possible with Email or online
